智能手表芯片_双模蓝牙_智能芯片-炬芯科技

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智能手表

智能无线音频SoC芯片系列

产品概况
技术规格
产品应用
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产品概况

炬芯科技智能穿戴芯片系列产品主要为双模蓝牙 5.4 单芯片解决方案。采用 MCU+DSP 双核架构，具备低功耗、高帧率等特点，蓝牙性能优越，支持AI ENC 通话降噪技术。高度集成了图形加速引擎与 Sensorhub 模块、蓝牙射频（RF）和基带、电源管理单元（PMU）、音频编解码器、屏和传感器外设接口模块等。在炬芯科技擅长低功耗技术的前提下，赋能智能穿戴产品高流畅的显示和超长的待机时间。

现在主推的智能手表芯片有：ATS3085L/3085C/3085，ATS3085E，ATS3085S，ATS3089等。

技术规格

CPU

DSP

GPU

MIC

Audio Effect

AI ENC

Bluetooth® Core

Max TX Power (BDR/BLE)

RX Sensitivity(Bluetooth®LE@1Mbps)

RX Sensitivity(Audio)

SensorHub

Internal RAM

SPI NOR

Standby Module

Interfaces

GPIO

Package

	ATS3089C	ATS3089	ATS3089P	ATS3085S(4)	ATS3085E	ATS3085L
CPU	MStar@202MHz	MStar@202MHz	192MHz MStar +192MHz DSP	128MHz M4F +192MHz DSP	MStar@192MHz	ARM M4F@128MHz/ Cortex-M4F@128MHz
DSP	DSP@202MHz	DSP@202MHz	1024KB	481KB SRAM + 4MB(OSPI DDR PSRAM)	DSP@192MHz	DSP@192MHz
GPU	2D + 2.5D (JPEG Decoder)	2D + 2.5D (JPEG Decoder)	2D + 2.5D (JPEG Decoder)	2D + 2.5D (JPEG Decoder)	2D (JPEG Decoder)	2D
MIC	2AMIC OR 2DMIC	2AMIC OR 2DMIC	2AMIC OR 2DMIC	2AMIC OR 2DMIC	2AMIC OR 2DMIC	2AMIC OR 2DMIC
Audio Effect	20 Bands PEQ/DRC/AGC	20 Bands PEQ/DRC/AGC	20 Bands PEQ/DRC/AGC	20 Bands PEQ/DRC/AGC	20 Bands PEQ/DRC/AGC	20 Bands PEQ/DRC/AGC
AI ENC	Single	Single	Single	Single	Single	Single
Bluetooth® Core	Dual-mode Bluetooth®6.0	Dual-mode Bluetooth®6.0	Dual-mode Bluetooth®6.0	Dual-mode Bluetooth®6.0	Dual-mode Bluetooth®6.0	Dual-mode Bluetooth®6.0
Max TX Power (BDR/BLE)	14dBm	14dBm	14dBm	14dBm	14dBm	13dBm
RX Sensitivity(Bluetooth®LE@1Mbps)	-99dBm	-99dBm	-99dBm	-99dBm	-99dBm	-98dBm
RX Sensitivity(Audio)	-95dBm	-95dBm	-95dBm	-95dBm	-95dBm	-95dBm
SensorHub
Internal RAM	1168KB + 8MB	1168KB + 16MB HPI PSRAM	1168KB + 32MB HPI PSRAM	1168KB + 4MB/8MB	1024KB	481KB SRAM + 4MB (OSPI DDR PSRAM)
SPI NOR	4MB（DTR）	8MB（DTR）	8MB（DTR）	External(DTR)	External(DTR)	External(DTR)
Standby Module	Shippingmode: <3uA + Deepsleep(no Ret)：<20uA	Shippingmode: <3uA + Deepsleep(no Ret)：<20uA	Shippingmode: <3uA + Deepsleep(no Ret)：<20uA	Shippingmode: <3uA + Deepsleep(no Ret)：<20uA	Shippingmode: <3uA + Deepsleep(no Ret)：<20uA	Shippingmode: <3uA + Deepsleep(no Ret)：<20uA
Interfaces	QSPI(DDR)/CPU8080/SPI/Dual SPI Interface/JDI parallel HSYNC/VSYNC interface	QSPI(DDR)/CPU8080/SPI/Dual SPI Interface/JDI parallel HSYNC/VSYNC interface	QSPI(DDR)/CPU8080/SPI/Dual SPI Interface/JDI parallel HSYNC/VSYNC interface	QSPI(DDR)/CPU8080/SPI/Dual SPI Interface/JDI parallel HSYNC/VSYNC interface	QSPI(DDR)/CPU8080/SPI/Dual SPI Interface/JDI parallel HSYNC/VSYNC interface	QSPI/CPU8080/SPI/ Dual SPI Interface
GPIO	60	60	60	49	49	46
Package	TFBGA129 （5.5X5.5X0.4pitch）	TFBGA129 （5.5X5.5X0.4pitch）	TFBGA129 （5.5X5.5X0.4pitch）	QFN68(7X7mm)	QFN68(7X7mm)	QFN68(7X7mm)