Our ICs
Wireless Transmitter
Low-latency Private Protocol SoC
General Info
Actions wireless transmission and transceiver series products series mainly consists of Bluetooth® dual-mode(core 6.0) single-chip solutions, adopting a CPU+DSP+NPU tri-core heterogeneous architecture and equipped with Actions' third-generation private protocol technology. These products feature high audio quality, high bandwidth, high performance, low latency, and low power consumption, and can be widely applied to various Bluetooth transmitting and transceiving integrated products, such as wireless microphones, gaming headsets and their dongles, conference speaker dongles, telephone headset dongles, TV dongles, game console dongles, walkie-talkie adapters, Bluetooth transmitting slave modules, transceiving integrated slave modules, projectors/CD/DVDs, and other related products that need to support Bluetooth transmission (connecting to Bluetooth headsets or speakers) and low-latency wireless audio transceiving.
Actions Technology is good at providing high-quality audio and low-latency wireless audio experiences under the premise of low power consumption. The main products in this series are equipped with advanced high-quality audio technology and low-latency technology. The ATS3231 series integrates a breakthrough NPU + DSP fusion architecture, excellent audio performance, strong wireless performance, and low-latency wireless transmission. It can be equipped with Actions' self-developed 48K AI NPU noise reduction algorithm to achieve full-scene adaptive and high-fidelity microphone AI noise reduction. With Actions' 2.4G private protocol, it can achieve an ultra-low end-to-end latency of 9ms, providing high-quality audio experience and high-definition call experience while meeting the requirements of low-latency transmission.
The currently promoted Bluetooth® transmitting and transceiving integrated chips include: ATS3231, ATS3031, and ATS2831 .
Technical Spec
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Bluetooth® Core |
CPU |
DSP |
AI |
RAM |
SPI norflash |
Max TX Power (BR) |
LE Audio |
NGPP-2.4 Low latency(end to end) |
Transmit audio input source |
USB |
Display |
Memory |
Connection Mode |
Package |
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ATS323X | ATS3031 | ATS2831P(L) | ATS2851 |
Bluetooth® Core | 6.0 | 5.4 | 5.4 | 5.4 |
CPU | ARM STAR MC1 @264MHz | ARM M4F @96MHz | 32bits RISC @264MHz | 32bits RISC @234MHz |
DSP | Cadence HiFi5+NN @504MHz | CEVA TL420 @170MHz | 32bits DSP @342MHz |
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AI | √ (up to 100Gops) |
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RAM | Build-in 2.88MB | Build-in 632KB | Build-in 498KB | Build-in 203KB |
SPI norflash | Build in 64Mbits Flash | Build in 16Mbits Flash | Build in 32Mbits Flash | Build in 16Mbits Flash |
Max TX Power (BR) | 16dBm | 13dBm | 10dBm | 10dBm |
LE Audio |
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NGPP-2.4 Low latency(end to end) | 9ms (2.5ms LC3+HR) | √/23ms(NAV) | 23ms(2831P NAV)/ 10ms(2831PL LC3+) |
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Transmit audio input source | LINEIN/USB/SPDIF/I2S/ MICIN | LINEIN/USB/I2S/ MICIN | LINEIN/USB/SPDIF/I2S/ MICIN | LINEIN/USB/SD/EMMC |
USB | USB2.0 HS DRD | USB2.0 FS | USB2.0 HS | USB2.0 FS |
Display | SPI LCD Built in display accelerator, up to 466*466 60fps | SPI LCD | SPI LCD | SPI LCD |
Memory | SDIO/ EMMC |
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SDIO/ EMMC |
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Connection Mode | 2T1R, 4T1R, 2T4R, 1TNR | 2T1R | 2T1R, 1T2R | 1T2R |
Package | QFN80 (8*8mm)/ QFN68 (7X7mm) | QFN44 (4X5mm) | QFN40 (5X5mm) | QFN32 (4X4mm) |
Applications
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Bluetooth® Transmitter
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Bluetooth® transceiver integrated device