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Wireless Transmitter

Low-latency Private Protocol SoC

  • General Info
  • Technical Spec
  • Applications
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General Info

Actions wireless transmission and transceiver series products series mainly consists of  Bluetooth® dual-mode(core 6.0) single-chip solutions, adopting a CPU+DSP+NPU tri-core heterogeneous architecture and equipped with Actions' third-generation private protocol technology. These products feature high audio quality, high bandwidth, high performance, low latency, and low power consumption, and can be widely applied to various Bluetooth transmitting and transceiving integrated products, such as wireless microphones, gaming headsets and their dongles, conference speaker dongles, telephone headset dongles, TV dongles, game console dongles, walkie-talkie adapters, Bluetooth transmitting slave modules, transceiving integrated slave modules, projectors/CD/DVDs, and other related products that need to support Bluetooth transmission (connecting to Bluetooth headsets or speakers) and low-latency wireless audio transceiving.

 

Actions Technology is good at providing high-quality audio and low-latency wireless audio experiences under the premise of low power consumption. The main products in this series are equipped with advanced high-quality audio technology and low-latency technology. The ATS3231 series integrates a breakthrough NPU + DSP fusion architecture, excellent audio performance, strong wireless performance, and low-latency wireless transmission. It can be equipped with Actions' self-developed 48K AI NPU noise reduction algorithm to achieve full-scene adaptive and high-fidelity microphone AI noise reduction. With Actions' 2.4G private protocol, it can achieve an ultra-low end-to-end latency of 9ms, providing high-quality audio experience and high-definition call experience while meeting the requirements of low-latency transmission.

 

The currently promoted Bluetooth® transmitting and transceiving integrated chips include: ATS3231, ATS3031, and ATS2831 .

 

Technical Spec PDF Download

Bluetooth® Core
CPU
DSP
AI
RAM
SPI norflash
Max TX Power (BR)
LE Audio
NGPP-2.4 Low latency(end to end)
Transmit audio input source
USB
Display
Memory
Connection Mode
Package
ATS323X ATS3031 ATS2831P(L) ATS2851
Bluetooth® Core 6.0 5.4 5.4 5.4
CPU ARM STAR MC1 @264MHz ARM M4F @96MHz 32bits RISC @264MHz 32bits RISC @234MHz
DSP Cadence HiFi5+NN @504MHz CEVA TL420 @170MHz 32bits DSP @342MHz
AI √ (up to 100Gops)
RAM Build-in 2.88MB Build-in 632KB Build-in 498KB Build-in 203KB
SPI norflash Build in 64Mbits Flash Build in 16Mbits Flash Build in 32Mbits Flash Build in 16Mbits Flash
Max TX Power (BR) 16dBm 13dBm 10dBm 10dBm
LE Audio
NGPP-2.4 Low latency(end to end) 9ms (2.5ms LC3+HR) √/23ms(NAV) 23ms(2831P NAV)/ 10ms(2831PL LC3+)
Transmit audio input source LINEIN/USB/SPDIF/I2S/ MICIN LINEIN/USB/I2S/ MICIN LINEIN/USB/SPDIF/I2S/ MICIN LINEIN/USB/SD/EMMC
USB USB2.0 HS DRD USB2.0 FS USB2.0 HS USB2.0 FS
Display SPI LCD Built in display accelerator, up to 466*466 60fps SPI LCD SPI LCD SPI LCD
Memory SDIO/ EMMC SDIO/ EMMC
Connection Mode 2T1R, 4T1R, 2T4R, 1TNR 2T1R 2T1R, 1T2R 1T2R
Package QFN80 (8*8mm)/ QFN68 (7X7mm) QFN44 (4X5mm) QFN40 (5X5mm) QFN32 (4X4mm)

Applications

  • Bluetooth® Transmitter
  • Bluetooth® transceiver integrated device

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