Our ICs
Wireless Transmitter
Bluetooth® Audio SoC
General Info
Actions wireless transmission and transceiver series products provide high integration and high performance Bluetooth® audio single chip solutions, integrated Bluetooth® radio frequency (RF) and baseband, power management unit (PMU), audio codec and MCU. Can be widely used in all kinds of Bluetooth® transceiver integrated products, such as gaming earphones and dongle, wireless microphones, conference speakers dongle, communications headset dongle, TV dongle, game-box dongle, intercom adapters, Bluetooth® emission slave module, transceiver integrated module, projector/CD/DVD and various devices that require Bluetooth® emission (connect Bluetooth® headset or Bluetooth® speakers) and other low-latency wireless audio transmission and reception products.
The series integrates Bluetooth® radio frequency (RF) and baseband, power management unit (PMU), audio codec and microcontrol unit (MCU) modules. Bluetooth® transmit power up to 13dBm, receive sensitivity -96dBm, complete specifications, leading performance. Support one to two (connect two Bluetooth® speakers or Bluetooth® headsets at the same time), support linein, USB, SPDIF (fiber or coaxial), I2S, MIC, SD/MMC, SPI and other audio input sources, support full-format audio decoding, support screen display, compatible with the market mainstream Bluetooth® speakers and Bluetooth® headsets, Support HFP AG 16K HD call, support two-way 48K HD voice transmission at the same time, compatible with win7/8.1/10/11/MAC and other mainstream operating systems and mainstream call conference software.
ATS3031 integrates high-quality audio codec, ultra-low delay wireless transmission path, ultra-wideband 32K dual-microphone AI noise reduction, DAC bottom noise is less than 2μV, and the Torch 2.4G private protocol can achieve ultra-low latency (the entire link can be as low as 23ms) when connected through dongle. Provide high-quality audio experience and HD call experience while meeting low latency transmission.
The wireless transmission and transceiver chips are mainly ATS3031,ATS2831P(L) and ATS2851.
Technical Spec
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BT Version |
CPU |
DSP |
AI |
RAM |
SPI norflash |
Max TX Power (BR) |
LE Audio |
NGPP-2.4 Low latency(end to end) |
Transmit audio input source |
USB |
Display |
Memory |
Connection Mode |
Package |
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ATS323X | ATS3031 | ATS2831P(L) | ATS2851 |
BT Version | V5.4 | V5.4 | V5.4 | V5.4 |
CPU | ARM STAR MC1 @264MHz | ARM M4F @96MHz | 32bits RISC @264MHz | 32bits RISC @234MHz |
DSP | Cadence HiFi5+NN @504MHz | CEVA TL420 @170MHz | 32bits DSP @342MHz |
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AI | √ (up to 100Gops) |
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RAM | Build-in 2.88MB | Build-in 632KB | Build-in 498KB | Build-in 203KB |
SPI norflash | Build in 64Mbits Flash | Build in 16Mbits Flash | Build in 32Mbits Flash | Build in 16Mbits Flash |
Max TX Power (BR) | 16dBm | 13dBm | 10dBm | 10dBm |
LE Audio |
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NGPP-2.4 Low latency(end to end) | 9ms (2.5ms LC3+HR) | √/23ms(NAV) | 23ms(2831P NAV)/ 10ms(2831PL LC3+) |
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Transmit audio input source | LINEIN/USB/SPDIF/I2S/ MICIN | LINEIN/USB/I2S/ MICIN | LINEIN/USB/SPDIF/I2S/ MICIN | LINEIN/USB/SD/EMMC |
USB | USB2.0 HS DRD | USB2.0 FS | USB2.0 FS | USB2.0 FS |
Display | SPI LCD Built in display accelerator, up to 466*466 60fps | SPI LCD | SPI LCD | SPI LCD |
Memory | SDIO/ EMMC |
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SDIO/ EMMC |
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Connection Mode | 2T1R, 4T1R, 2T4R, 1TNR | 2T1R, 4T1R, 2T4R | 2T1R, 1T2R | 1T2R |
Package | QFN80 (8*8mm)/ QFN68 (7X7mm) | QFN44 (4X5mm) | QFN40 (5X5mm) | QFN32 (4X4mm) |
Applications
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Bluetooth Transmitter
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Bluetooth transceiver integrated device