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Smart Glasses

Smart Wireless Audio SoC

  • General Info
  • Technical Spec
  • Applications
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General Info

Actions Technology’s  smart wearable chip series primarily features dual-mode Bluetooth® 6.0 single-chip solutions. Adopting an MCU + DSP dual-core architecture, these solutions offer low power consumption, superior Bluetooth performance, and support AI-based ENC call noise reduction. These series chips highly integrate Bluetooth RF and baseband, a power management unit (PMU), audio codecs, as well as display and sensor peripheral interface modules. In smart glasses applications, they mainly enable Bluetooth connectivity, audio processing, and display functionality.

 

Key smart glasses chips currently promoted include ATS3089C, ATW6095, and others.

Technical Spec PDF Download

Smart Glasses IC
MCU
NPU
Internal RAM
SPI NOR
Standby Module
 Interface
GPU
DSP/EQ Audio Codec
ENC
Analog/Digital Mic
ADC SNR
DAC SNR
DAC THD+N
Bluetooth® Technology
RX Sensitivity (Bluetooth®LE@1Mbps)
Max TX Power (BDR/BLE)
Package
Smart Glasses IC ATS3089C ATW6095
MCU 202MHz MStar +202MHz DSP 240MHz MStar +420MHz HIFI5
NPU / 100GOPS@INT8 CIM NPU
Internal RAM 1168KB + 8MB 2.88MB
SPI NOR 4MB(DTR) 8MB(DTR)
Standby Module Shippingmode: <3uA + Deepsleep(no Ret):<20uA Shippingmode: <3uA + Deepsleep(no Ret):<70uA
 Interface QSPI(DDR)/CPU8080/SPI/Dual SPI Interface/JDI parallel HSYNC/VSYNC interface QSPI(DDR)
GPU 2D + 2.5D (JPEG Decoder) 2D
DSP/EQ Audio Codec 20 Bands PEQ/DRC/AGC 20 Bands PEQ/DRC/AGC
ENC AI ENC AI ENC
Analog/Digital Mic 2AMIC OR 2DMIC 4AMIC And 8DMIC
ADC SNR 97db 112db
DAC SNR 108db 113db
DAC THD+N -90db -100db
Bluetooth® Technology Bluetooth® Dual-mode (Core 6.0) Bluetooth® Dual-mode (Core 6.0)
RX Sensitivity (Bluetooth®LE@1Mbps) Typ : -99dBm Typ : -99dBm
Max TX Power (BDR/BLE) 14dBm 14dBm
Package TFBGA129 (5.5*5.5*0.4pitch) TFBGA139 (5.5*6.0*0.4pitch)

Applications

  • Smart Glasses

Contact sales

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